According to a new report released recently from China, it appears that Qualcomm plans to reveal more details about the next Snapdragon 820 processor at a special event will be held on August 11 in Las Vegas . In fact, this news is not surprising at all because of the problems which the current processor floundering Snapdragon 810 due to excessive heat, which the customer was forced to avoid the purchase of smart phones like the HTC One M9 and + Xperia Z3 because of exhaustion reports of excessive heat which processor Snapdragon caused by 810 of these phones Smart. In fact, these things have influenced directly on the financial results of Qualcomm in the second quarter of this year so that the company recently announced that it is obliged to give up 15% of its employees.
In March last, Qualcomm announced Snapdragon processor 820, but the company only said that it will feature new nuclei called Kyro mesh 64bit and the fact that it will be manufacturing this new processor with a new technology is not FinFET technology.
While Qualcomm did not publish the official technical specifications for the processor Snapdragon 820, it has previous leaks and rumors indicated that this processor will feature four double nuclei with a frequency of 1.7GHz cores and two other cores in the 2.2GHz frequency. Other specifications of the processor Snapdragon 820 graphics processor Adreno 503 class frequency 650MHz, and support LPDDR4 random memory, as well as support LTE Cat networks. 10 high speed. As is always the case with all previous leaks and rumors, there is no way to verify the authenticity of these rumors except to wait As of 11 August.
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