Korean publication ETNews is claiming that Apple’s upcoming iPhone 7 smartphone refresh will reduce electromagnetic interference by encapsulating major chips, including its application processor, into an electromagnetic interference (EMI) shielding.
The company has decided to take this move to further increase the performance of its devices, while reducing the electromagnetic interference that occurs due to the increased clock signal of chips. Additionally, this will further help in reducing the electromagnetic waves that are emitted from the phone, which should alleviate fears that some people have.
According to an industry insider, “As clock signals of digital chips have increased and as diverse functions such as 3D-touch and others have recently added, reduction of electromagnetic waves have emerged as major topic of this industry.”
Other benefits of EMI shielding include more densely packed circuit boards, leaving extra space for the battery. On the downside, the process of applying EMI shielding will slightly raise the cost of chips’ production.
Taiwanese companions StatsChipPac and Amkor will be charged with applying EMI shielding on major chips of the iPhone 7, which should take place in their facilities in South Korea, as per the report.
Like with any other rumor related to the iPhone 7, I’d recommend readers to take this one with a big pinch of salt, especially since this is the first time we are hearing about this. Do you think Apple will apply individual EMI shields to key chips inside the iPhone 7 and iPhone 7 Plus?
The SiP process could basically eliminate the printed circuit board in iPhones if all of its chips will be squeezed into a tiny package. In addition to more efficient power performance, the approach could allow Apple to engineer a waterproof device more easily.
[Source]
According to an industry insider, “As clock signals of digital chips have increased and as diverse functions such as 3D-touch and others have recently added, reduction of electromagnetic waves have emerged as major topic of this industry.”
Other benefits of EMI shielding include more densely packed circuit boards, leaving extra space for the battery. On the downside, the process of applying EMI shielding will slightly raise the cost of chips’ production.
Taiwanese companions StatsChipPac and Amkor will be charged with applying EMI shielding on major chips of the iPhone 7, which should take place in their facilities in South Korea, as per the report.
Like with any other rumor related to the iPhone 7, I’d recommend readers to take this one with a big pinch of salt, especially since this is the first time we are hearing about this. Do you think Apple will apply individual EMI shields to key chips inside the iPhone 7 and iPhone 7 Plus?
The SiP process could basically eliminate the printed circuit board in iPhones if all of its chips will be squeezed into a tiny package. In addition to more efficient power performance, the approach could allow Apple to engineer a waterproof device more easily.
[Source]
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