According to a new report recently released from South Korea, it seems that Apple is working on making the iPhone 7 thinner than the iPhone 6S, but at the same time providing a larger battery. How so? Well, it seems that the removal of headphones port is one of the methods used by Apple to make the iPhone 7 thinner than previous generations.
At the same time, it is expected that Apple's using the "Fan-out" system, which means install multiple components in one small element, and what this means is making the motherboard of the phone iPhone 7 is small in size, and this is what allows the addition of other components such as extra battery. It was also said that Apple began offering requests for its suppliers in Japan and other markets.
Earlier it was said that TSMC produces the processors of 16 nanometer (nm) with the use of the accumulated design "Fan-out" for a single client, and if the rumors are true, it appears that TSMC company may be the company's main or perhaps the only company that will oversee Apple processor A10.
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